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MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2015

Jan 21, 2015

MV-6E In-Line AOI Machine.

MV-6E In-Line AOI Machine.

MV-7 OMNI-QHD 3D In-Line AOI Machine.

MV-7 OMNI-QHD 3D In-Line AOI Machine.

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.

We are very excited about the products that we will be presenting at APEX 2015,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “MIRTEC will feature three distinct lines of inspection equipment specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry. MIRTEC’s PRECISION SERIES consists of our NEW MV-9-QHD 3D AOI Machine, paired with an MS-15 3D SPI Machine. These high-end inspection systems are designed to address the inspection speed and defect detection requirements associated with the manufacturing of PCBs used in Smartphones, Tablet PCs and automotive systems. MIRTEC’s PERFORMANCE SERIES consists of the NEW M7 OMNI-QHD 3D AOI Machine paired with an MS-11 3D SPI Machine. These advanced inspection systems are designed to address Intermediate inspection requirements associated with more than 90 percent of electronics manufacturers throughout the world. NEW to APEX 2015, MIRTEC’s ADVANTAGE SERIES consists of our MV-6E AOI Machine paired with an MS-11E 3D SPI Machine. These cost effective inspection systems are designed to provide our customers with a much needed competitive edge in the highly demanding electronics manufacturing industry.”

PRECISION SERIES:

The NEW MV-9-QHD 3D In-Line AOI Machine features the next generation of MIRTEC’s award-winning OMNI-VISION® 3D Inspection Technology in a Precision Linear Drive Platform. This revolutionary technology combines our proprietary 25MP CoaXPress Vision System with MIRTEC’s exclusive Quantum High Definition (2048x1536) Digital Multi-Frequency 3D Projection Technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. This new technology will, undoubtedly, set the standard by which all other 3D inspection equipment will be measured. The MV-9-QHD machine also features four (4) 10 Mega Pixel Side-View Cameras for inspection of regions of interest that are not accessible with the 25 MP Top-Down Camera. 

The MS-15 3D In-Line SPI Machine is configured with MIRTEC’s exclusive 25MP CoaXPress ISIS Vision System, providing enhanced image quality, superior accuracy and lightning fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-15 uses the same robust platform as MIRTEC’s MV-9 Series.

PERFORMANCE SERIES:

The NEW MV-7 OMNI-QHD 3D In-Line AOI Machine features the next generation of MIRTEC’s award-winning OMNI-VISION® 3D Inspection Technology in a High-Performance AC Servo Drive Platform.  This revolutionary technology combines our proprietary 15MP CoaXPress Vision System with MIRTEC’s exclusive Quantum High Definition (2048x1536) Digital Multi-Frequency 3D Projection Technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. This new technology will, undoubtedly, set the standard by which all other 3D inspection equipment will be measured. The MV-7 OMNI-QHD machine also features four (4) 10 Mega Pixel Side-View Cameras for inspection of Regions of Interest which are not accessible with the 15 MP Top-Down Camera. 

The MS-11 3D In-Line SPI Machine is configured with MIRTEC’s exclusive 15MP ISIS Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging.  The MS-11 uses the same robust platform as MIRTEC’s MV-7 OMNI Series.


ADVANTAGE SERIES:

MIRTEC’s ALL NEW MV-6E In-Line AOI Machine combines MIRTEC’s exclusive 10 Mega Pixel Top-Down camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras in a newly designed cost effective platform. The system also is configured with MIRTEC’s exclusive Intelli-Scan Laser System, providing superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices.

MIRTEC’s ALL NEW MS-11E 3D In-Line SPI Machine combines MIRTEC’s exclusive 15MP ISIS Vision System with Dual Projection Shadow Free Moiré Phase Shift Imaging Technology in a newly designed cost effective platform to inspect solder paste depositions on PCBs post screen print.

MIRTEC also will exhibit an MV-7xi In-Line AOI Machine configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. The MV-7xi features a 2D camera bar code reader, a high-throughput three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan 3D Laser System providing superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability.

The MV-3L Desktop AOI Machine is the industry’s most widely accepted five camera desktop AOI system.  This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras. It also features the Intelli-Beam 3D Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

The MV-2GT Desktop AOI Machine provides Advanced Technology to the electronics manufacturing industry at an affordable price.  The machine is configured with a single Top-Down 5 Mega Pixel Digital Color Camera System and a three stage LED Lighting System. These systems offer superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc.  The system software is very powerful yet extremely simple to use. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.

MIRTEC’s total quality management system software, INTELLISYS, also will be on display at the IPC APEX EXPO. This software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies.

MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico, “We look forward to welcoming visitors to our booth #2333 during the three-day event.”


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please visit www.mirtec.com.

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