SMT, PCB Electronics Industry News

A-Laser to Highlight New LDS Capability at D2P Marlborough

Sep 23, 2014

molded interconnect device

molded interconnect device

FCT Assembly announces that the A-Laser Division will discuss its new laser direct structuring (LDS) capability in Booth #444 at the Design 2 Part Show, scheduled to take place Oct. 1-2, 2014 at the Royal Plaza Trade Center in Marlborough, MA. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design and enhancing product capability.

When manufacturing LDS 3-D circuits, there often are three components to the development process. Prototypes are developed with LPKF’s proprietary proto-paint process in combination with a raw part from virtually any plastic. Next, the manufacturing industry has seen numerous innovations in the realm of 3-D printed parts through advancements in materials and printing technology. Due to the quick-turn nature of this process; cycle times can be reduced greatly in the development phase. Finally, mold injected parts, from LDS grade materials, can be brought to full-scale production.

From prototypes to production, A-Laser guides customers through the entire project. The engineering department excels in design, while also keeping in mind process implementation and cost reduction goals. Further, LPKF has created a design guide (http://a-laser.com/assets/LDS-MID_DesignGuide.pdf) allowing optimization opportunities from the onset. For more information about A-Laser’s LDS capability, visit http://a-laser.com/3dcircuits.html. For more information about A-Laser’s advanced technology, visit www.a-laser.com.


A-Laser is a premier precision parts manufacturer, providing consistent, high quality laser services for a wide range of industries. Specializing in the processing of ultra-thin materials, our technicians provide solutions for your most challenging applications.

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