SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist

Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist

Jan 25, 2016

DF-3010 Dry Film Negative Photoresist.

DF-3010 Dry Film Negative Photoresist.

Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3010 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3010 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3010 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.

DF-3010 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

For more information about the DF-3010 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Jul 07, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

Feb 08, 2016 -

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Jan 25, 2016 -

Engineered Materials Systems receives IDTechEx award for printed electronics technology

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist news release has been viewed 902 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist
SMT fluid dispensing

Software for SMT