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Circuit Technology Center Installs Second Hentec/RPS Robotic Hot Solder Dip Machine

Feb 09, 2021

BGA

BGA

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities

Newman Lake, WA (February 9, 2021) – Hentec Industries/RPS Automation is pleased to announce that Circuit Technology Center has installed its second Hentec/RPS Odyssey 1325 robotic hot solder dip machine.  The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload and is capable of processing dual solder alloys.  Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.  The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.

“Hentec Industries is an instrumental partner to Circuit Technology Center as we continue the expansion of our BGA re-balling and component tinning services department to support our high reliability and defense industry customer base”, said Jeff Ferry, President of Circuit Technology Center.  “We have now purchased multiple systems from Hentec, and they have been terrific to work with, implementing a variety of custom options to their standard Odyssey 1325 RHSD platform to suit our specific requirements.  Customer support from upper management to their field service department has been top notch.”

About Circuit Technology Center

For over 35 years, Circuit Technology Center has been recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.  For more information, please visit: www.circuitrework.com.

About Hentec Industries

Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution.  Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s.

All Hentec/RPS products are designed and manufactured in Newman Lake, Washington.  For more information, please visit www.rpsautomation.com.

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If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or tbaro@rpsautomation.com.

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