Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.
Newman Lake, WA (April 13, 2021) – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published an engineer’s guide to the component re-conditioning process. This tech paper encompasses critically important information about re-conditioning of electronic components prior to soldering and is entitled “An Engineer’s Guide to Component Re-Conditioning Using the Robotic Hot Solder Dip Process.” This 6-page tech paper outlines essential information for high reliability circuit board assembly applications and can be downloaded by accessing www.circuitnet.com/papers.
Topics covered within this publication include gold embrittlement, gold removal, component re-conditioning, BGA de-balling, re-tinning standards compliance and solderability test methods. The advantages and disadvantages of outsourcing component re-conditioning to an external service provider vs, insourcing with an internal component re-tinning operation are covered including cost and production backlogs.
About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.
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