Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Newman Lake, WA (May 4, 2021) – Hentec Industries/RPS Automation is pleased to announce that Retronix Ltd. has installed a Hentec/RPS Odyssey 1750 robotic hot solder dip machine in their Scotland facility. The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1750 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
Founded in 1992, Retronix Ltd. provides technology solutions for electronics in high reliability sectors including alloy conversion and re-tinning, BGA de-balling and re-balling, and tin whisker mitigation solutions. Headquartered in Scotland, Retronix has facilities worldwide including throughout Europe and North America. For more information, please visit: www.retronix.com.
About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s.
All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit www.rpsautomation.com.
If you would like more information on system sales, please contact Tom Baro at 509-385-1228 or firstname.lastname@example.org.