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Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Jan 14, 2019

SMART DESOLDER 01.

SMART DESOLDER 01.

Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).

Using innovative new technology developed by our Martin subsidiary, the SMART DESOLDER 01 combines a manual hot-gas source with a vacuum pen for non-contact extraction of residual solder. This process-controlled method has advantages over the hand wick (braid) technique by effortlessly removing components without applying and re-applying uncontrolled heat and pressure to the PCB over and over.

Damage to the pads from overheating or mechanical stress is avoided through targeted convection heating of the residual solder after component removal. The temperature-controlled airflow prevents the neighboring components from heating up. After melting, the residual solder is removed – without contact - using a vacuum pen. The Teflon tip in the vacuum pen offers a nonstick effect, temperature-resistance, and a soft surface material with a long shelf life.

As a compact, stand-alone device, it virtually fits on any workbench and can be easily operated for practically any surface mount device. Martin also provides bottom heaters HOTBEAM 04 or 05 - a perfect complement the SMART DESOLDER 01. These HOTBEAMS optimize the temperature curve by means of a sensor-based or programmed preheating profile.


Finetech is a leading manufacturer of equipment for manual and fully automatic high-precision bonding and component rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research. Corporate headquarters and main production are in Berlin, Germany. Sales and Technical support centers are located in Gilbert, Arizona; Amherst, New Hampshire; Shanghai, China; Kuala Lumpur, Malaysia; and Tokyo, Japan. www.finetechusa.com.
 


 

Apr 07, 2016 -

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Jan 04, 2013 -

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Sep 26, 2012 -

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Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

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