FINETECH to Demonstrate Compact Rework System at SMTAI 2009

Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.

FINETECH’s complete rework station is designed specifically for customers needing a fixed configuration, with quick set up and easy operation. Offering 10 micron placement accuracy, it is most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards. Applications include BGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small passives, connectors, RF-shields, shielding frame, flip chip rework as well as customized applications.

The Fineplacer® CRS 10 is equipped with a sophisticated reflow module for top heating and high-performance full-area bottom heating. Additional features include a patented Vision Alignment System with stationary beam splitter, controlled Z-height during reflow, a reliable rework process, and an automated component place and lift-off function.

About FINETECH

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.