Jul 28, 2009
Copper erosion, voiding, and tin whiskers are only a few of the problems in the field of lead-free soldering. Nihon Superior has the knowledge with SN100C and its proven 10-year track record to solve users’ challenges. SN100C can reduce bridges with uniform eutectic solidification, provide good through-hole fill, and reduce voiding resulting in low defect manufacturing and high reliability.
Additional performance features of SN100C include excellent melting performance, prevention of shrinkage cavities, excellent ductility, reduced copper erosion and stabilized IMC. It provides long service life in thermal cycling conditions, as well as excellent impact resistance in BGA applications, and vibration resistance.
For additional features of SN100C solder alloy and to view the presentation, visit
http://www.nihonsuperior.co.jp/english/ppt_swf/sn100c/sn100ckadai/.
About Nihon Superior Co. Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.
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