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Nihon Superior’s Technical Director to Present Assessment of Microalloyed Sn-Zn as a Solder at ICSR 2011

Apr 07, 2011

Keith Howell, Nihon Superior’s Technical Director,

Keith Howell, Nihon Superior’s Technical Director,

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell, Technical Director, will present a paper titled "Assessment of Microalloyed Sn-Zn as a Solder for Electronics Assembly" at the upcoming International Conference on Soldering & Reliability (ICSR), scheduled to take place May 3-6, 2011 at the Crowne Plaza Toronto Airport Hotel in Toronto, ON. The presentation will take place Wednesday, May 4, 2011 at 9:30 a.m.

Given the advantages of reduced damage to components and laminate, as well as energy savings that could accrue as a result of a melting point 20ºC lower than the liquidus temperature of SAC305, the tin-9 percent zinc eutectic alloy has been attracting the attention of the electronics industry as a potential lead-free solder. If solders based on the tin-zinc eutectic are to find wider application, the problem of corrosion will have to be addressed.

The presentation will provide a detailed assessment of the effect of a microalloying addition of manganese on the mechanical integrity of tin-zinc alloy joints on copper, nickel, and silver substrates after exposure to elevated temperature (150ºC) and humid heat (85ºC/85 percent RH) for up to 1000 hours. The nature and extent of corrosion on the surface, and the solder/substrate interface was examined using SEM/EDX and found to vary considerably with the substrate.

Keith has more than 25 years of industry experience including 20 years in the field of electronics assembly and soldering. He has been involved in various roles in the development, manufacture and marketing of new products, and is currently Technical Director for the Americas for Nihon Superior, the developer of SN100C lead-free solder. Keith has a Bachelor’s Degree in Mechanical Engineering from the University of Illinois and a Master’s Degree from the University of Rochester, and has presented at numerous seminars on lead-free soldering as well as on process improvements at past conferences.


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

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