Jan 23, 2008
The International Engineering Consortium's (IEC) today announced that it will host a record-breaking number of exhibitors at DesignCon 2008 this February 4�7 in Santa Clara
Chicago � January 22, 2008 � The International Engineering Consortium (IEC) rings in the New Year with a record number of exhibitors for its annual DesignCon 2008. With more than 135 key exhibiting companies, the event serving semiconductor engineers has also drawn a record number of pre-registered attendees. In addition, more than 300 experts will present 120 educational sessions to complement the cutting-edge exhibition at the Santa Clara Convention Center in Santa Clara, CA.
"I think the response to DesignCon thus far is illustrative of the continued value its exhibition and educational program bring to design engineers," commented IEC President John Janowiak. "We look forward to the entire electronic design value chain being represented on this year's exhibition floor."
The DesignCon 2008 exhibition will feature EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more. It will bring box and board designers together with chip designers and others involved in system-level design.
Major sponsors of the event include Official Host Sponsor Agilent Technologies; Rambus; LeCroy; Tektronix; BERTScope; Amphenol; Cisco; Hewlett Packard; IBM; Intel; Redback Networks; Sun Microsystems; Xilinx; and Wipro.
The DesignCon 2008 exhibition will also feature TecPreviews, the annual DesignTour and five pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, the Verification Technology Pavilion and the University Pavilion.
For a complete exhibitor listing, visit http://www.designcon.com/2008/exhibition/exhibitor_list.html.
All industry professionals may register at http://www.designcon.com/2008/register/index.asp.
Visit http://www.designcon.com/2008/ for full information or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.
About DesignCon 2008
Now in its twelfth year, the International Engineering Consortium's DesignCon 2008 conference and exhibition will present more than 300 experts in its world-class educational program and 135 exhibitors on its cutting-edge exhibition floor this February 4-7, 2008 at the Santa Clara Convention Center in Santa Clara, CA. Agilent Technologies serves as the official sponsor and Mr. Terry Morris, a fellow of the high performance systems division at Hewlett-Packard, serves as the conference chair.
More than 120 premier educational sessions will complement five pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, the Verification Technology Pavilion and the University Pavilion. The DesignVision Awards and DesignCon Paper Awards also take place at the event giving tribute to outstanding contributions to the industry.
Co-located events include meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum will also feature panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference. For complete information, visit http://www.designcon.com/2008/
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit http://www.iec.org.
