Apr 11, 2010 
Aquasol can be used with any common soldering alloy. SnPb and lead-free SAC and SN100C versions are available, all exhibiting excellent performance in the four key process steps: printing (including fine-pitch capability), placement, reflow and cleaning. Due to a perfect balance between adhesive and cohesive forces, there is efficient separation from the squeegee and good aperture release with long stencil life.
The rosin nature of this water-soluble paste is unique, with paste rheology, solderability and water washability conferred by carefully selected surface chemistry and activators. With Aquasol Branded paste, it is possible to print at speeds high enough to meet or exceed the throughput of any SMD line. Furthermore, the paste features excellent slump resistance and residues can be removed with de-ionized water.
The pastes’ extended tack time allows a longer period between printing and placement. Additionally, the high tack force holds components in place during transportation prior to soldering.
With Aquasol Water Soluble paste, voiding is minimized in both air and nitrogen processes. Post-soldering flux residue can be removed using hot de-ionized water with or without cleaning agents. The ideal temperature and water pressure depend on the complexity of the assembly and efficiency of the wash method and equipment.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group. The Cobar Group is accredited to the prestigious ISO/TS 16949 Quality Management System
