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STI and Contributors to Present Results of 2 Research Papers At SMTA International Technical Conference

Aug 04, 2019

STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, in cooperation with lead author Mike Bixenman, DBA, KYZEN, and other contributors, announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).

The papers focus on the problem of cleanliness for QFN component packages and risk management for Class 3 hardware. With the increased focus on cleanliness throughout electronics manufacturing, this topic is of great interest across the industry. Mark McMeen, STI’s VP of Engineering Services and Manufacturing, has been busy working on the evaluation of cleanliness and its effects on reliability for all hardware with a focus on IPC Class 3 products.

Attendees at the SMTAI Conference will have the opportunity to attend two presentations. The conference will take place at the Donald E. Stephens Convention Center, Sept. 22-26, 2019 in Rosemont, IL.

The first paper, “Characterize and Understand Functional Performance of Cleaning QFN Packages on PCB Assemblies – iNEMI Cleanliness Research Study” is the result of 18 contributors who came together to predict and understand the functional performance of residues present under single row QFN component packages. The group’s objective was to develop and collect a set of guidelines for understanding the relationship between ionic contamination levels, and cleanliness. With the knowledge gained, the team will establish a reference Test Suite and Test Spec for cleanliness.

The second presentation will be, “Risk Management of Class 3 Electronics as a Function of Cleanliness.” The advanced technology and harsh environments inherent in Class 3 hardware and their production means that all aspects of the systems must be evaluated for reliability. The purpose of the paper is to apply risk management strategies to contaminations. The information gained will be used to improve methods of proving out and developing better methods for qualifying soldering and cleaning processes at the point of manufacture.

Click on the following link for information and registration for the SMTA International Technical Conference.

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