SMT, PCB Electronics Industry News

Do Solder Voids Matter - Defect of the Month

Jun 16, 2019

Defect of the Month online or in Circuits Assembly

Defect of the Month online or in Circuits Assembly

Bob Willis Defect of the Month explains solder joint voids and are they an issue to everyone? Bobs webinar guide to voids in solder joints and how to overcome them in manufacture is available online and covers all of the different voids and solutions from his archives see https://www.bobwillis.co.uk/product/online-webinar-archive-booking/

The video is just one of the Defect of the Month videos featured by IPC, SMTA and Circuits Assembly to help provide better understanding of process issues and help support training of younger engineers

Past Defect of the Month magazine pages are available online at Circuits Assembly magazine or the videos at https://www.youtube.com/user/MrBobwillis

Jun 10, 2019 -

New Bob Willis Book Reviews

Jun 10, 2019 -

Our Defect of the Month Video

Mar 11, 2019 -

Harsh Environment Failure – Causes & Cures FREE SMTA Europe Webinar

Feb 15, 2019 -

Defect of the Month Videos

Feb 15, 2019 -

New Book Reviews for Electronic Assembly

Nov 20, 2018 -

NPL New 2019 Webinars are Launched

Oct 23, 2018 -

Soldering & Assembly Webinars for 2019 Anounced

Aug 23, 2018 -

Manual Cleaning A Step by Step Guide Online

Aug 23, 2018 -

Cleaning, Contamination Testing & Defects Photo Album

Jul 03, 2018 -

Solder Squeeze Out on Underfilled Boards - Defect of the Month

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Jul 15, 2019 -

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

Jul 15, 2019 -

ZESTRON Academy to Host FREE "Defluxing Advanced Packages" Webinar

Jul 12, 2019 -

Congratulations on the successful conclusion of Semicon West Expo

Jul 12, 2019 -

Fuji America Adds to its Representative Network in the Western Region

Jul 10, 2019 -

Introducing Our Newest Partner Kyzen

Jul 09, 2019 -

Naprotek Supports San José Youth Job Shadow Week

Jul 09, 2019 -

SHENMAO to Exhibit Low-Temperature Solder Pastes at SMTA Ohio Expo

Jul 09, 2019 -

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 22nd

Jul 09, 2019 -

Press preview for Seica Inc. participation at Semicon West, July 9-11, 2019, Booth # 1865, San Francisco, CA. The Core Concepts of Industry 4.0 -

Jul 09, 2019 -

ZESTRON will be Exhibiting at SEMICON West

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