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Test Research, Inc. to Highlight Latest Smart Factory Inspection Solutions at NEPCON Japan 2019

Jan 06, 2019

Meet the next generation of High-Quality AOIs at TRI's booth. Featuring the new TR7700 SV 3D AOI with improved Image quality at industry leading speed. Furthermore presenting the new Multi-Angle 3D AOI solution TR7500QE SIIoffering higher quality imaging for side view inspection.
 
Discover TRI's World-Class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications. TRI will exhibit the Global Technology Award-winning TR7007QI series 3D SPI. Also showcasing, TRI's new cutting-edge Inline 3D AOI TR7700Q with unprecedented 1um Resolution for High Accuracy and Reliability Testing.  
 
Realize your production line's potential with TRI's PCBA Test and Inspection solutions, and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.

Aug 07, 2020 -

Semiconductor and Advanced Packaging Inspection at SEMICON Taiwan 2020

Jul 14, 2020 -

TRI Introduces New AOI Solution at NEPCON Asia 2020

Jul 09, 2020 -

TRI won two EM Asia Innovation Awards for AOI and ICT

Jun 18, 2020 -

TRI releases new ICT Solution: BSI Plus

Nov 27, 2019 -

TRI to Feature Innovative Inspection Solutions at NEPCON Japan 2020

Nov 20, 2019 -

TRI Receives 2019 Global Technology Award for TR7700 SV 3D

Aug 21, 2019 -

Test Research, Inc. to participate in SMTAI 2019

May 07, 2019 -

Test Research, Inc. receives 2019 EM ASIA Outstanding Product of the Year

Apr 30, 2019 -

Huber Automotive AG selects TRI for PCBA SPI, AOI, CCI AOI and AXI solutions

Jan 27, 2019 -

TRI to Participate in Smart Factory Live Production Line at IPC APEX EXPO 20

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2020 Charles Hutchins Educational Grant Winner Announced

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Sep 22, 2020 -

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