SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B)

JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B)

Jun 22, 2011

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B. The revised standard may be downloaded free of charge from JEDEC’s website.

The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits. It is applicable for use by the package manufacturer and the microcircuit manufacturer, from incoming inspection of package components through final inspection of the completed microcircuit. JESD9B also supersedes and incorporates a complete rewrite of JESD27, Ceramic Package Specification for Microelectronic Packages. In addition, JESD9B includes all pertinent areas of MIL-STD-883 and Test Method 2009: External Visual, and is meant to be used in conjunction with but not contradict these standards.

JESD9B incorporates new criteria and updates old criteria based upon advancements in the packaging industry and user failure modes history, both increasing criteria where appropriate for increased quality and reducing criteria where appropriate based upon usage history. The standard also includes clear and easy-to-interpret color photos or diagrams for every condition listed.

“The revised standard was made possible by countless hours of collaboration from metal and ceramic package manufacturers, hybrid/microcircuit/semiconductor manufacturers, and space/aerospace/military and commercial users,” said Shawn Graham, Chief Operations Officer of VPT, Inc. and Chairman of the JC-13.5 Task Group 134 which updated the standard. “We believe the publication of JESD9B will be welcome news to all manufacturers and users who will benefit from a common reference point for these essential inspection criteria.”
 


JEDEC is the leading developer of standards for the microelectronics industry.  Over 3,000 participants, appointed by nearly 300 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge.

Jan 13, 2012 -

JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Jan 07, 2012 -

JEDEC Publishes Breakthrough Standard for Wide I/O Mobile DRAM

Aug 24, 2011 -

JEDEC Announces Key Attributes of Upcoming DDR4 Standard

Jun 16, 2011 -

JEDEC Announces Publication of e-MMC Standard Update v4.5

Mar 21, 2011 -

JEDEC Announces Broad Spectrum of 3D-IC Standards Development

Feb 24, 2011 -

JEDEC Announces Publication of Universal Flash Storage (UFS) Standard

Feb 10, 2011 -

JEDEC to Standardize Hybrid Memory Modules

May 15, 2022 -

Ultrasonic Cleaning Machine HJS-1036A

May 14, 2022 -

Camera Lens Cleaning Machine HJS-9800,semi conductor Camera Lens Cleaning Machine

May 13, 2022 -

Nozzle Cleaning Machine HJS-390,SMT Nozzle cleaning machine,

May 13, 2022 -

Koh Young Future Forum 2022 Session 2: Faster Smaller Denser: Inspecting Semiconductor Packages

May 13, 2022 -

Auto Labeling Machine

May 12, 2022 -

ARIES Embedded Introduces OSM Compatible SIPs for Industrial Controls and IoT

May 12, 2022 -

Pneumatic Fixture Cleaning Machine HJS-6600,Fixture Cleaning Machine

May 12, 2022 -

Electric Fixture Cleaning Machine HJS-6700,Fixture Cleaning Cleaner,pallet cleaning machine

May 11, 2022 -

Squeegee Cleaning Machine HJS-4300,ink, glue liquid screen squeegee automatic cleaning machine for screen printer

May 11, 2022 -

ViTrox Hosts User Group Meeting (UGM) 2022 in Mexico on 12 May 2022

See electronics manufacturing industry news »

JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B) news release has been viewed 684 times

  • SMTnet
  • »
  • Industry News
  • »
  • JEDEC Announces Publication of Inspection Criteria for Microelectronic Packages and Covers (JESD9B)
Zero returns due to coating issues

MSD Dry Cabinets