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Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Feb 01, 2018

For substrates up to 480mm during semiconductor packaging

Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

For wafer cleaning, the MesoSPHERE plasma system removes contamination prior to wafer bumping, organic contamination, fluorine and other halogen contamination, and metal and metal oxides. Plasma improves spun-on film adhesion and cleans metallic bond pads.

For wafer etching, the MesoSPHERE plasma system descums wafers of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhances adhesion of wafer applied materials, removes excess wafer applied mold /epoxy, enhances adhesion of gold solder bumps, destresses wafer to reduce breakage, improves spun-on film adhesion, and cleans aluminum bond pads.

The MesoSPHERE's chamber design and control architecture enable short plasma cycle times with very low overhead, maximizing throughput and minimizing cost of ownership. Plasma confinement technology uses a ring to isolate and focus plasma so it's distributed directly above the wafer, minimizing undesired secondary reactions. Process temperatures can be kept low because the ring increases etch rate capability without increasing the electrode temperature or adding bias to the chuck.

An innovative handling system transfers round or square substrates and frame or bonded carriers. The modular design allows capacity increase on a per plasma chamber basis. Equipment front end module (EFEM) integration supports from 1 to 4 plasma chambers. A pocket chuck design provides accurate substrate placement and centering, for additional process repeatability.

"A unique feature of the MesoSPHERE is the way we developed the isolation," explained Jonathan Doan, director of marketing for Nordson MARCH. "It allows our customers a method to perform advanced packaging without having to use an expensive carrier and it can be used with 300mm wafers on frames."


Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems that improve product reliability and increase production yields. Delivering over 30 years of continuous innovation Nordson MARCH is a global leader in plasma processing technology for manufacturing semiconductors, printed circuit boards, microelectronics, and medical devices with offices and labs worldwide, including the USA, Europe, Singapore, China, Japan, and Korea. An expert staff of scientists and engineers is available to assist development of plasma processes. Visit Nordson MARCH at www.nordsonmarch.com, Facebook or Twitter.

Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, test and inspect for quality, and treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. Visit Nordson at www.nordson.com, Twitter or Facebook.

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Nordson MARCH Wins 2017 New Product Introduction Award for its ModVIA Plasma System

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