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Hesse & Knipps is now Hesse Mechatronics

Mar 06, 2013

Hesse Mechatronics develops and delivers customer specific equipment for the back-end: heavy wire and thin wire wedge bonder, ultrasonic flipchip bonder and special systems right up to complete production lines.

Hesse Mechatronics develops and delivers customer specific equipment for the back-end: heavy wire and thin wire wedge bonder, ultrasonic flipchip bonder and special systems right up to complete production lines.

Name Change Signifies Move Back to Company Roots

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, formally announces the company’s recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.

The name change is a move back to the company’s roots, named Hesse GmbH when first launched in 1986. In addition, the new name signifies more accurately what the company does - which is to develop and manufacture the most advanced thin wire wedge bonders and heavy wire bonders in the world, utilizing mechatronics, or a multidisciplinary engineering approach that combines mechanical, electrical, control and computer engineering to achieve the best possible equipment performance.


Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s heavy wire bonders also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

Jan 24, 2014 -

Hesse Mechatronics Appoints Representative for South America

Oct 31, 2013 -

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Jun 07, 2013 -

New Dual-Head Wedge Bonder Makes Americas Debut

May 06, 2013 -

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Apr 13, 2013 -

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics.

Sep 04, 2012 -

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Aug 14, 2012 -

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Aug 02, 2012 -

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Jul 25, 2012 -

Hesse & Knipps, Inc. Appoints New Technical Training Manager

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