Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

The new thermally and electrically conductive adhesives are designed to enable high thermal transfer in LED and power semiconductor packages. The materials are engineered to withstand JEDEC level 1/ 260°C reliability standards in LED packaging applications. DA-5045-2 is currently used in manufacturing lines assembling LED packages for automotive lighting.

The DA-5045-2 and DA-5045-4 have thermal conductivities > 20 W/mK when measured by laser flash. Both products feature high glass transition temperatures (Tg) and modulus to enable wire bonding of the die, and are electrically conductive for static drain. DA-5045-2 and DA-5045-4 are the latest additions to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.

Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.