SMT, PCB Electronics Industry News

World’s Best Flip Chip Underfill: SMT 158 Series

Aug 12, 2014

(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.

The SMT 158 series is customizable in color, filler concentration, and particle sizes to meet each individual customer’s needs. This underfill has excellent reliability and has an extremely fast flow. It cures fast and in low temperatures. It can be utilized for bare chip protection in advanced packages like memory cards, chip carriers, hybrid circuits, and multi-chip modules. Using SMT158 will eliminate the cleaning process. SMT 158 series is compatible with lead free processes and is good for ultra-low bump applications. It can be used on several applications like chip scale packages, ball grid array devices, PoP, land grid array, and some flip chip applications. SMT 158 series provides mechanical resistance and minimizes induced stresses.

Underfill products have been around for a while, however an underfill product like the SMT 158 series distinguishes itself from the competition. It can be applied to several applications and is customizable to meet the needs of the customers.Additional information on the product series is available on our Website at: http://www.yincae.com/technical-information.html or by contacting YINCAE at: tfarrell@yincae.com.

                                             * * * * * * * *
YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

FOR ADDITIONAL INFORMATION CONTACT:

Taylor Farrell Business

Development Specialist

YINCAE Advanced Materials, LLC 19 Walker Way Albany, NY 12205

Phone: (518) 452-2880

E-mail: tfarrell@yincae.com
                                                        ###
The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jun 22, 2023 -

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Mar 27, 2023 -

YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Nov 08, 2022 -

YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

Aug 16, 2022 -

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

Mar 30, 2022 -

YINCAE's DA158N Die Attach Materials withstanding -273°C

Dec 22, 2021 -

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

Feb 24, 2021 -

YINCAE's New SMT 158N Series withstanding -273°C

Jan 21, 2021 -

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Aug 04, 2020 -

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Sep 05, 2019 -

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

48 more news from YINCAE Advanced Materials, LLC. »

Apr 18, 2024 -

ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment!

Apr 16, 2024 -

I.C.T | Your One-Stop Service for Smart Meter SMT Factory

Apr 15, 2024 -

Three Industry Leaders Receive IPC President's Award

Apr 15, 2024 -

IFTEC's Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

Apr 15, 2024 -

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

Apr 15, 2024 -

IPC Publishes Comprehensive Strategy to Address Electronics Industry's Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

Apr 15, 2024 -

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Apr 15, 2024 -

IPC Announces New Board Members at IPC APEX EXPO 2024

Apr 15, 2024 -

Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO

Apr 15, 2024 -

IPC Releases "J" Revisions to Two Leading Standards for Electronics Assembly

See electronics manufacturing industry news »

World’s Best Flip Chip Underfill: SMT 158 Series news release has been viewed 873 times

See Your 2024 IPC Certification Training Schedule for Eptac

convection smt reflow ovens