SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Jan 16, 2018

(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes, increase throughput, and reduce costs.

Reflowable underfills are dispensed or printed onto the board before component placement occurs. The design of these materials allow it to stay in place and not flow away from the designated areas, allowing component placement to occur in a subsequent step.

YINCAE offers a low temperature curable unfilled reflowable underfill material: SMT 160L. This underfill provides high reliability, has a built-in flux function, cures at 140 – 170°C, and can eliminate voids. This material has also been designed to be applied through dipping, dispense, or printing methods, giving the design engineer greater flexibility.

For more information on YINCAE’s reflowable underfill: SMT 160L, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Sep 04, 2018 -

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Jul 19, 2018 -

YINCAE at IWLPC 2018

Jul 03, 2018 -

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018 -

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 14, 2018 -

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 08, 2018 -

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

Apr 09, 2018 -

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Mar 30, 2018 -

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

28 more news from YINCAE Advanced Materials, LLC. »

Sep 23, 2018 -

PVA to highlight conformal coating at productronica India

Sep 23, 2018 -

Comtree to represent Kurtz Ersa Inc. at the EPTECH Mississauga and EPTECH Waterloo shows

Sep 23, 2018 -

Specialty Coating Systems to Present during Machine Design Webinar

Sep 23, 2018 -

IPC & SMTA to Host Hi-Rel Cleaning & Conformal Coating Conference

Sep 23, 2018 -

MicroCare Addresses PCB Cleaning with New Products at SMTAi

Sep 23, 2018 -

Aegis Software Participates In UK Debut Of CFX IIoT Demo at What’s New in Electronics Live (WNIE)

Sep 23, 2018 -

BTU’s Fred Dimock will present at ACI Technologies’ Open House

Sep 23, 2018 -

Kurtz Ersa Inc. launches Smartflow training courses in response to market demand

Sep 23, 2018 -

Saki Selects Jayson Moy as General Manager, Saki Asia Pacific

Sep 22, 2018 -

ADLINK to Participate at GPU Technology Conference, Munich 9-11 October, 2018

See electronics manufacturing industry news »

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L news release has been viewed 80 times

  • SMTnet
  • »
  • Industry News
  • »
  • Press Release: Low Temperature Reflowable Underfill Material: SMT 160L
used pcb assembly equipment - lel semi

Reflow Oven