(Albany, NY) 12/31/2018 – YINCAE will be attending the 52nd Symposium on Microelectronics in Boston, MA from October 1-3, 2019 held at the Hynes Convention Center. We invite you to attend and visit our booth to learn what new and innovative products we have to offer this year.
This year YINCAE Advanced Materials offers premier products including our Solder joint encapsulant paste which can provide lower temperature soldering and be used at a higher temperature (300⁰c). Our 50% filler nano-underfill can flow fast into small gaps (10m) at room
temperature while our high-end underfills are fully compatible with flux residue and has zero
gassing. We also offer Die Attach materials as well as Diamond Underfills. YINCAE continues
to exceed customer expectations and develop specialized solutions for not only flip chip, CSP,
BGA, POP, LGA, but also many more applications. We hope you take this opportunity to visit us at iMAPS where our experts will not only provide a unique perspective to your needs but also provide immediate product recommendations that are guaranteed to create a solution and improve efficiency.
For more information about our products and services, please visit our website at: www.yincae.com. We hope to see you at iMAPS 2019!