Aug 16, 2022 
Press Release
YINCAE’s Fully Flux Residue Compatible Underfill: UF 158HA
(Albany, NY) August 15, 2022 YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill. Using UF 158HA can eliminate cleaning process and pollution from the cleaning process, and simplify the manufacturing process.
Due to its unique properties, UF 158HA is not only a high performance underfill but also can function as solder mask with eliminating electric migration. The benefits of using UF 158HA are:
- Fully compatible with all no-clean solder paste flux reside
- Eliminating cleaning process and its pollution
- Large cost saving
- Pass 5x260 ºC without any deformation of solder joint
- Better than all competitors’ underfill with cleaning process
- Be able to flow into 20m gap
- Withstand high temperature up to 400 ºC.
