Ormet Circuits Inc. announced the introduction of its new Ormet® DAP-491-1 Transient Liquid Phase Sintering (TLPS) paste. TLPSpastes are lead-free and high-temperature stable sintering solder systems for semiconductor packaging and assembly.
Ormet DAP-491-1 is a Pb-free, TLPS paste formulated for attachment of metalized die to metalized substrates. It is processed via lead-free reflow but exhibits extremely high thermal stability beyond 350°C after sintering and will withstand subsequent lead-free reflow temperatures above 260°C without re-melting.
Ormet DAP-491-1 is an excellent alternative to gold-based and lead-based solders as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput.
Ormet delivers high reliability and environmentally friendly interconnect materials for use in assembled advanced semiconductor packages. For more information, visit www.emdgroup.com.
Ormet Circuits develops and delivers advanced materials for the packaging and assembly of semiconductors and electronics.From R&D customization to high volume scale up, Ormet’s rich portfolio of innovative sintering pastes and alternative solder materials and chemistries enable lead(Pb)-free, gold-free, and nano-free packaging solutions for a wide variety of demanding applications requiring high thermal conductivity, high temperature stabilityand superior long-term reliability. For more information, visit www.emdgroup.com.