Dec 26, 2022 ZESTRON is pleased to announce that ZESTRON’s Senior Application Engineer, Ravi Parthasarathy will be presenting, “Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs”, at IPC APEX 2023 taking place in San Diego, California.
CoW (Chip on Wafer) is the next generation of CoS (Chip on Substrate) that first combines the chips to the interposer, adds wafer-level molding, and finally, they are connected to the flip chip (FC) substrate. This technology makes a better physical structure for accommodating very large die and larger overall interposer dimensions.
A continuation from the technical paper presented at APEX 2022 and titled “Defluxing of Copper Pillar Bumped Flip Chips,” this new study concentrates on cleaning under the next level of ultra-fine pitch CoW devices down to less than 25μm bump pitch and bump counts of more than 150K. This study focuses on the impact of wash temperatures and conveyor belt speed utilizing analytical/functional testing, including Visual Inspection, FTIR with color mapping, and SEM/EDX to assess cleanliness.
To download the APEX 2022 technical paper, “Defluxing of Copper Pillar Bumped Flip Chips” visit the ZESTRON Technical Articles page.
ZESTRON is headquartered in Manassas, Virginia, and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our technical centers, please visit www.zestron.com.
