CheckSum today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The team will showcase its new Parallel Functional Test in Booth #3445.
Small boards create numerous problems for electronics manufacturers because of the mismatch between production throughput and test throughput. This mismatch has been addressed by manufacturers in three ways: slowing production, batch processing with WIP Inventory buildup, and adding test capacity to match production throughput. Each of these approaches has costs and side-effects for manufacturers.
An increase in panel density is driving substantial efficiency and throughput gains on the SMT lines; however, typical testing processes are unable to match this increased throughput.
A new kind of test technology utilizes simultaneous functional testing of the entire panel of small boards. Parallel Test provides benefits to manufacturers by matching SMT line throughput. The major benefits of this new technology are:
Enabling Inline Test to eliminate human handling,
Provide Real-Time Data to Intelligent Digital Systems,
Eliminate the need for WIP Inventory, reducing rework issues, increasing throughput and efficiency, and simplifying the process by eliminating test cell operations.
For more information about CheckSum or to schedule a meeting during Apex, visit http checksum.com/news/ipc-apex-expo-booth-3445
For more than 30 years, CheckSum has been developing technologies to make board test more accurate, reliable and efficient. Our systems are well equipped to serve a wide variety of industries from the world’s most complex telecom boards to some of the smallest flex circuits in mobile devices.
CheckSum provides full-service solutions: test systems, fixtures, programs, and worldwide support. For more information, visit www.checksum.com.