MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association.The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center,China.
MacDermid Alpha will be featuring itscomplete portfolio of metallization technologies from the MacDermid Alpha brand for HDI designs that provide a continuous metalurgical structure for the most demanding requirements in micro via reliability. MacDermid Alpha will also showcase its product offerings that enable 5G from start to finish from all three divisions and four brands.Also highlighted will be therecently released processes in the IC Substrate market; Systek SAP – high performance build-up processes, Systek UVF 100 – via fill and fine line plating for 2-in-1 RDL applications, and Systek ETS 1200 – pattern plating metallization for embedded trace substrates.
Interested participants can stop by booth, 2M13, to talk to our industry experts about the latest offerings from MacDermid Alpha.
Find out more at MacDermidAlpha.com or email us at email@example.com.
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.