MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, “Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?” on April 19 at 10:30 am New York / 3:30 pm London.
The industry continues to struggle with Head-in-Pillow (HiP) defects, especially as the density of component packages on boards continues to increase. Kevin Martin, Regional Product Manager for SMT Solutions, will be one of the industry experts participating in the panel which will discuss the causes, challenges, and possible solutions for mitigating this defect. The webinar will include a live Q&A session following the roundtable discussion.
Kevin Martin recently joined the MacDermid Alpha Electronics Solutions Assembly Division as Product Manager for SMT Solutions. In this role, he supports the development and implementation for the global strategy and management of the Alpha and Kester portfolios of industry leading solder pastes. Martin has over 10 years of experience in the electronics manufacturing industry in roles such as technical service, business development, and product management.
To register for the panel, please click here. For additional information on the Assembly portfolio of solutions to optimize process flexibility and enhance reliability in PCB assemblies, please visit macdermidalpha.com.
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.