SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62

StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62

Mar 05, 2018

StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort and Casino in Fountain Hills, Arizona.

StratEdge packages come in leaded and leadless drop-in formats, leaded and leadless surface mount formats, and specialty high power and high speed digital designs. Some of the packages on display will be:

  • New, off-the-shelf molded ceramic packages that meet the requirements to handle 18 GHz devices, including gallium nitride (GaN).
  • LL family of high-power laminate copper-moly-copper (CMC) base packages with a ratio of 1:3:1 CMC that include both GaN transistor and MMIC device packages.
  • SE50 series with the industry's lowest electrical loss design for compound semiconductors operating at frequencies as high as 63 GHz.
  • MC Series of molded ceramic packages in standard, open-tooled configurations, which are all MIL-STD hermetic.
  • Leaded Power Amplifier packages for GaAs power amplifiers. This proven design has been used in countless point-to-point, point-to-multipoint, and VSAT applications.
  • Hermetic SMT packages in some of the most popular industry standard, no-lead outlines for use where standard plastic packages cannot meet the reliability or performance requirements of a particular application.
  • High-speed digital and mixed signal packages that can be customized for speeds in excess of 40 GB/s.

"5G, and its high-power infrastructure, and IoT and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical," said Tim Going, StratEdge president. "Packages can no-longer be an after-thought. They not only are necessary for heat dissipation, but also to ensure that the electrical connection is accurate and the device functions as intended, without electrical losses. The IMAPS Device Packaging Conference is a great place to discuss your package requirements."

For more information, contact StratEdge at info@stratedge.com, shop at the StratEdge store on Amazon.com, sign up for the StratEdge newsletter, and/or visit our new website at www.stratedge.com.


StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly and test services. We specialize in packages for high-frequency, very high power, extremely demanding Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices and have a complete line of post-fired and molded ceramic semiconductor packages that operate from DC to 50+ GHz. Our patented electrical transition designs give StratEdge packages exceptionally low electrical losses, even at 50+ GHz. Markets served include telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and MEMS. StratEdge is an ISO 9001:2008 facility.

Sep 26, 2018 -

StratEdge to Display GaN and GaAs Packages at IMAPS, BCICTS, and EDI CON USA

Aug 22, 2018 -

StratEdge Receives ISO 9001:2015 Quality Management Systems Certification

Jun 04, 2018 -

StratEdge Features Packages for the Extreme Demands of GaN and GaAs Devices at IMS2018 in Booth 1649

Jul 26, 2017 -

StratEdge Introduces New, Mobile-Friendly Website www.stratedge.com serves as resource for high-frequency semiconductor packages

May 03, 2017 -

StratEdge Semiconductor Packages Now Sold on Amazon.com

Oct 18, 2018 -

Libra Industries announces new inside sales associate

Oct 18, 2018 -

Seica SpA To Exhibit at electronica 2018

Oct 18, 2018 -

NEO Tech Earns Industry Award for Contract Manufacturing Services at SMTA International

Oct 18, 2018 -

IPC Announces 2019 Standards Committee Meeting Schedule

Oct 18, 2018 -

IPC & SMTA Announce Session 2 of High-Rel Cleaning & Conformal Coating Conference

Oct 18, 2018 -

Practical ComponentsĀ® to Exhibit Its Newest Wafer and Evaluation Vehicles Technologies at IWLPC

Oct 18, 2018 -

Surface Mount (SMT) Assembly Cost in China

Oct 18, 2018 -

How to Generate Gerber Files Using Altium Designer

Oct 18, 2018 -

Lead-Free Manufacturing Processes At No Extra Cost

Oct 18, 2018 -

Generating Gerber files from KiCad

See electronics manufacturing industry news »

StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62 news release has been viewed 77 times

  • SMTnet
  • »
  • Industry News
  • »
  • StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
fluid dispensing

Reflow Oven