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Western Digital Corp. Releases Industry’s First 96-Layer 3D NAND UFS 2.1 Embedded Flash Drive for High-End Smartphones

Oct 15, 2018

SOURCE:https://www.jotrin.com/technology/details/WESTERN_DIGITAL_INAND_MC_EU321_EFD

SAN JOSE, Calif.--(BUSINESS WIRE)--Western Digital Corp. (NASDAQ: WDC) Releases Industry’s First 96-Layer 3D NAND UFS 2.1 Embedded Flash Drive for High-End Smartphones, the Western Digital iNAND® MC EU321, accelerating the possibilities of artificial intelligence (AI), augmented reality (AR), multi-camera high-resolution photography, 4K video capture and other demanding applications for high-end mobile and compute devices.

The flash memory capacity is 32GB, 64GB, 128GB, 256GB, based on Western Digital's own master control, the interface supports UFS 2.1 Gear3, two channels, support Western Digital's own iNAND SmartSLC 5.1 cache technology, the performance of the nominal continuous read and write can be up to 800MB / s, 500MB/s, random read and write can reach 50,000 IOPS, 52000 IOPS.

It is packaged in a BGA package and measures only 11.5 x 13 x 1 mm. It can be easily placed in today's smartphones and tablets, and its capacity is sufficient for notebooks, VR heads and other devices.

Western Digital began shipping 96-layer stacked 3D flash memory from April this year, and released its first SSD based on it in July. This is the first time that it has entered the embedded field.

What is the Features

.UFS 2.1 Gear3 2-Lane

.iNAND® SmartSLC 5.1 technology

.Plug-and-Play integration

.Field Firmware Upgrade (FFU)

.Multiple RPMB regions

.Secure Write Protection

.Health and diagnostic reporting

.Production State Awareness

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