Congrats Successful End on Asia Nepcon 2019- The Biggest SMT/EMS Industry Event

Sep 03, 2019

The biggest Asian Electronics Events "Nepcon Asia 2019" was closed last Friday, thank you all the professionals to visit our Unicomp booth to deeply discuss the new features of X-ray technologies for BGA soldering inspection as well as SMD Chip counting application.

During the Asia Nepcon 2019, Unicomp displayed our new AX8200N X-ray, which is newly upgrading version of our best-selling model AX8200, it’s renewed with new design, larger platform, optimized image processing software, welcome to contact Unicomp team to understand more cutting-edge features of Unicomp AX8200N X-Ray.

Besides the upgraded AX8200N BGA X-Ray, there is upgraded Unicomp AX9100 X-Ray system with much better optimized image processing software and hot demand LX2000 online PCBA X-Ray system for SMT production line.

Unicomp Technology established in the year 2002, which focus on X-Ray technology for over 15 years. We produce high resolution SMT/EMS X-ray inspection machine with OEM service and factory price.

To know more information about our product and Unicomp Technology, please feel free to contact us by email: marketing@unicomp.cn or visit our website: www.unicompxray.com.

Congrats Successful End on Asia Nepcon 2019- The Biggest SMT/EMS Industry Event news release has been viewed 578 times

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