Laserssel Co., LTD announces that it was awarded a 2019 Global Technology Award in the category of Soldering – Selective for its LSR (Laser Selective Reflow). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany
“This revolutionary soldering technique enables the assembly of challenging applications with a robust, high yield and cost-effective solution,” states Denis Barbini, General Manager of Laserssel.
LSR is a novel soldering technique that solders temperature sensitive, warpage prone, very fine pitch, odd form, big die, SiP, wearables, flex to flex, and various other mainstream and niche applications defect-free, high yield and with a low cost of ownership.
The BSOM (Beam Shaping Optical Module): This patented industry-leading technology takes the energy of a spot laser and turns it into a uniformly distributed area laser. The uniformity of the energy is greater than 95 percent. The result is a homogenous distribution of energy over the entire area to be soldered enabling the proper coalescence, wetting, intermetallic formation to take place forming the final electronic interconnect or solder joint. Laserssel designs and manufactures this technology in-house.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
With its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices. For more information, visit www.laserssel.com.
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semiconductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process.