SMT, PCB Electronics Industry News

Automatic High Speed Glue Dispenser D1

Aug 06, 2020

Automatic High Speed Glue Dispenser D1:
Application Range:
Encapsulation protection of PCB board and FPC soft board parts, reinforcement of camera module, fingerprint recognition
module dispensing IC chip, component underfill and component encapsulation shell frame dispensing
Red phosphor, dam, precision coating, etc. filled with phosphor of LED.

FPC flexible circuit board is a flexible printed circuit board with high reliability and high quality, which is made
of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness
and good bendability.
Feature:With the development trend of miniaturization, portability and diversification of functions of
electronic products, in order to improve the reliability of the tiny flexible substrate (FPC), the entire
components (such as 0402, 0201) are encapsulated, or the lead chip is introduced. Foot encapsulation has
become an indispensable process, and flexible substrates (FPC) are often used in miniaturized portable
electronic products, such as smartphone cameras, microphones, and display screens. The size itself is tiny, the
pitch between each device is very small, and the process of each device cannot affect each other. In this way,
higher requirements are placed on the equipment of the encapsulation process.

Any inquiry would be appreciated by Mobile/WeChat: 0086 13063047785 or scan my WeChat QR code.

Yours sincerely

Wellman Rau

Senior Manager

International Business Dept.

Mobile/Wechat/WhatsApp: +86 130 6304 7785


Email: ;

Shenzhen HTGD Intelligent Equipment Co., Ltd.


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