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  • ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings

ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings

May 31, 2012

ECD's MAP 3.00 software operates within a unique Environment, which is attuned to specific profiling jobs.  Here, the Environment list can be seen on the toolbar on the left hand side of the image.

ECD's MAP 3.00 software operates within a unique Environment, which is attuned to specific profiling jobs. Here, the Environment list can be seen on the toolbar on the left hand side of the image.

Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization. 

Function-rich and environment-adaptable, MAP 3.00 offers in-depth data and analysis capability within a highly versatile software platform that seamlessly integrates with all ECD profiling hardware.  MAP 3.00 allows engineering specialists to utilize ECD sensor inputs to ECD M.O.L.E. thermal profilers for operation within a unique Environment, which is attuned to the specific profiling job.  The software switches from one application to the next, allowing effortless transitions between wave soldering and reflow processes.


ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology.  Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced in-transit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others.  Well-known for its data-rich software platform and robust hardware functionality, ECD is the thermal profiling choice of engineering professionals worldwide. For more information on ECD and its products, visit www.bakewatch.com | www.ecd.com.

Oct 31, 2017 -

ECD to Display Complete Range of Thermal Profiling and Verification Solutions, Introduce Breakthrough Oven Process Monitoring Technology at Productronica 2017

Mar 01, 2017 -

ECD Ranks Highest Among Soldering Equipment Providers, Honored with Second Consecutive Service Excellence Award

Apr 07, 2016 -

ECD’s Customers Give High Marks for Service; Company Earns a Coveted Service Excellence Award

Mar 22, 2016 -

ECD Expands Successful SmartDRY™ Intelligent Dry Storage Portfolio with Addition of SmartDRY SD-48F

Nov 01, 2015 -

EI Microcircuits Leverages ECD’s Suite of Measurement Technologies to Ensure Robust Thermal Processes

Sep 11, 2014 -

ECD Taps Todd Clifton to Lead Company.

Nov 05, 2012 -

Do You Own the Oldest M.O.L.E.®? Enter to Win a SuperM.O.L.E.® Gold 2 kit

Apr 13, 2009 -

ECD Debuts Thermal Quality Management Program: ThQM

Apr 09, 2009 -

ECD Launches New Thermosphere BLOG for Electronics Industry

Aug 02, 2001 -

ECD Soldering Seminar Will Help Improve Yields, Reduce Re-work and Increase Profitability!

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ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings news release has been viewed 626 times

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