Jul 25, 2012 
Hesse & Knipps, Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as Technical Training Manager.
Allan will provide technical training on Hesse & Knipps’ family of semiconductor packaging equipment including high speed fine pitch wedge bonders and heavy wire bonders. Training will be offered at Hesse & Knipps’ demonstration and applications facilities in Clinton, Mass. and Anaheim, Calif. in addition to on-site at customer facilities. Allan will also conduct demonstrations of Hesse & Knipps wedge bonding equipment and related software, enabling customers to validate and qualify wedge bonders prior to making an investment in new technology.
Allan possesses more than two decades of experience in the semiconductor industry, having most recently worked at Eastman Kodak Company as a microelectronics packaging technician and, previously, at Xerox Corporation as a wafer fab technician. In addition to earning a degree in Electronics Technology, Allan holds a certificate of business degree – management process from Rochester Institute of Technology.
“Allan’s knowledge in wafer fab operations, microelectronics packaging and semiconductor processing equipment will serve our customers well as he provides training that addresses their specific wire bonding equipment and manufacturing requirements,” notes Joseph Bubel, president of Hesse & Knipps.
For more information on Hesse & Knipps and its family of wedge bonders, please visit the company’s website at :www.hesse-knipps.com; to view videos of wedge bonding equipment in action, please visit: www.wirebonddemo.com. For more information on Hesse & Knipps’ training programs, e-mail info@hesse-knipps.us.
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon). The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.
For more information, please visit the company’s website at www.hesse-knipps.com.
