Aug 01, 2012 The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 18, 2012 as a focused symposium at SMTA International in Orlando, FL. The scope of this year's symposium relates to the findings of the iNEMI consortium, which examined the reliability of several new Pb-free solders as well as the results of the Pb-free Electronics Risk Management (PERM) consortium efforts addressing the impact of Pb-free solutions on high-reliability electronics that are built for military, space, and avionic applications.
The first session will cover the iNEMI Pb-Free Alloy Characterization Project Report: Thermal Fatigue Performance. The second and third sessions will function as a workshop on Dependable Electronics with Lead-Free Components/Systems built into the symposium. The fourth session is Lead-Free Solder Joint Reliability: Meet the Experts.
Papers will be presented by speakers from Alcatel-Lucent, Auburn University, Amkor Technology, Hewlett-Packard, iNEMI, Lockheed Martin, Raytheon Company, and Rockwell Collins among others.
Details of the Lead-Free Soldering Technology Symposium can be found at http://www.smta.org/smtai/symposium.cfm#lf or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or joann@smta.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
»
