SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • ZESTRON Presents “Cleaning Under Low Stand-off Components” at SMART Group Annual Conference & Exhibition 2012

ZESTRON Presents “Cleaning Under Low Stand-off Components” at SMART Group Annual Conference & Exhibition 2012

Sep 17, 2012

 ZESTRON, the worldwide leader in high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce that Robert Murphy, ZESTRON Regional Sales Manager Europe, is scheduled to present the paper “Cleaning Under Low Stand-off Components” at the SMART Group Annual Conference & Exhibition taking place September 18th and 19th in Thame, Oxfordshire, UK. 

Contacts, commonly found under components such as BGAs, micro BGAs or CSPs, pose mechanical barriers and complicate the capillary penetration of the cleaning and rinsing agent.  ZESTRON has conducted a study to determine which type of mechanical agitation would result in the best overall cleaning performance and address this issue.  Mr. Murphy will present the results of the study on September 19th.

ZESTRON invites you to learn more about cleaning under low stand-off components and to have your cleaning questions answered by one of our cleaning experts.  To register for this event or to get additional information, please visit http://www.smartgroup.org/.


 ZESTRON:
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With five worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our unparalleled technical centers, please visit http://www.zestron.com.

 

May 20, 2024 -

ZESTRON Announces Upcoming Webinar on Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment

May 13, 2024 -

ZESTRON Offers Free Webinar on Advancements in Solder Paste Printing

May 06, 2024 -

ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series

Apr 29, 2024 -

ZESTRON Academy Introduces Cutting-Edge SMT Webinar Series for 2024

Apr 22, 2024 -

ZESTRON Welcomes Whitlock Associates as new Addition to their Existing Rep Team in Florida

Apr 22, 2024 -

ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 18, 2024 -

ZESTRON and Indium Corporation to Present Advancements in Solder Paste Printing at IPC APEX EXPO 2024

Mar 11, 2024 -

ZESTRON to Showcase Cutting-Edge Cleaning Solutions at IPC APEX EXPO 2024

Mar 04, 2024 -

ZESTRON to Present at Upcoming iMAPS Device Packaging Conference

471 more news from ZESTRON Americas »

Dec 02, 2024 -

PDR Offers Advanced Infrared Heating Technology for BGA Rework

Dec 02, 2024 -

SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

Dec 02, 2024 -

Count On Tools Introduces Custom Yamaha YS12/24 MC12/24 Special Gripper Nozzle

Dec 02, 2024 -

Naprotek to Exhibit at SMTA Silicon Valley for On-the-Spot Hiring

Dec 02, 2024 -

Subdued Electronics Industry Sentiment Continues in November

Dec 02, 2024 -

Durable PCB Assemblies with Advanced Conformal Coating Technology

Nov 27, 2024 -

Introducing "Essemtec TechTalk: Engineering SMT Solutions"

Nov 27, 2024 -

Enhancing Nexperia's Production Capabilities with the Essemtec Fox All-in-One

Nov 27, 2024 -

How to Enhance SMT Production Line Stability: A Comprehensive Guide from Equipment Selection to Maintenance

Nov 25, 2024 -

North American EMS Industry Up 14.7 Percent in October

See electronics manufacturing industry news »

ZESTRON Presents “Cleaning Under Low Stand-off Components” at SMART Group Annual Conference & Exhibition 2012 news release has been viewed 908 times

  • SMTnet
  • »
  • Industry News
  • »
  • ZESTRON Presents “Cleaning Under Low Stand-off Components” at SMART Group Annual Conference & Exhibition 2012
Conductive Adhesive & Non-Conductive Adhesive Dispensing

SMT feeders