SMT, PCB Electronics Industry News

Rocket EMS Awarded ISO 13485:2003 Certification

Nov 27, 2012

 Rocket EMS Inc., a Silicon Valley EMS provider of printed circuit board (PCB) layout, assembly, test and integration services, has achieved ISO 13485:2003 certification. This internationally recognized standard acknowledges the suitability of the company’s quality management system for the design and manufacture of medical devices.
The certification of our Quality System, first to ISO 9001:2008 and AS 9100C in March 2012, and now ISO 13485:2003, demonstrates Rocket’s commitment to delivering exceptional product quality to our customers across all fields, including medical, aerospace, telecom, industrial and consumer,” said Michael Kottke, Rocket EMS President.
The primary objective of ISO 13485 is to ensure process quality for layout, development, production, installation and servicing of medical devices. It includes all the requirements of ISO 9001 with emphasis on regulatory requirements as they relate to medical devices.

Rocket EMS, based in San Jose California, is an electronic manufacturing services (EMS) provider specializing in a full suite of new product introduction (NPI) services as well as low and medium volume high-mix production. Combined with Rocket’s strategic partnership with EMS provider EPIC technologies, Rocket can provide services from PCB layout and ultra-quick-turn manufacturing through high-volume production across all product spectrums.

Nov 15, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding

Oct 06, 2016 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative tone Photoresists at Semicon Europa

May 09, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC

Aug 23, 2015 -

Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC

Feb 26, 2013 -

Engineered Material Systems Introduces Die Attach for Temperature-Sensitive Applications

Jan 21, 2013 -

Engineered Material Systems Introduces New Low-Temperature Cure Die Attach

Dec 04, 2012 -

Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141

Nov 27, 2012 -

Engineered Conductive Materials to Discuss New ECA Technology at the 8th CSPV Workshop in Shanghai

Nov 02, 2012 -

Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at the MWT Back Contact Workshop in Amsterdam

Nov 08, 2011 -

Engineered Conductive Materials introduces DB-1588 Low Cost Conductive Adhesive for Back Contact Solar Modules

8 more news from Engineered Conductive Materials, LLC »

Jan 19, 2022 -

MVP Expands the Application of the 900 and Versa Platforms at IPC APEX EXPO 2022

Jan 18, 2022 -

Chris Heesch New Regional Sales Manager for BTU

Jan 18, 2022 -

Pick-n-Place with a One-Two Punch and more from Hanwha at APEX

Jan 18, 2022 -

APCT Inc. Earns IPC-1791, Qualified Manufacturers Listing (QML) as Trusted Electronics Fabricator

Jan 14, 2022 -

Award-Winning Murray Percival Co. to Represent Anda Technologies

Jan 14, 2022 -

Best Technical Papers at IPC APEX EXPO 2022 Selected

Jan 14, 2022 -

Southwest Systems Technology appoints new outside account manager for North Texas

Jan 14, 2022 -

SCS to Introduce Cutting-Edge Coating and Curing Technologies at APEX

Jan 14, 2022 -

IPC's Wage Rate and Salary Survey for North American Electronics Assembly Companies Open Until January 28

Jan 14, 2022 -

NexLogic Acquired by Naprotek, a Portfolio Company of Edgewater Capital Partners

See electronics manufacturing industry news »

Rocket EMS Awarded ISO 13485:2003 Certification news release has been viewed 534 times

Electronics Equipment Consignment

Voidless Reflow Soldering