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Ascentech LLC Announces Aprotec Z-Check 3D Benchtop SPI Measurement Systems

Apr 15, 2013

The Z-Check 3D system is the latest addition to the successful Z-check family. It provides a large scanning area and unique 5-line LED scanning in addition to all the major features of this well established bench top solder paste inspection system.

The Z-Check 3D system is the latest addition to the successful Z-check family. It provides a large scanning area and unique 5-line LED scanning in addition to all the major features of this well established bench top solder paste inspection system.

Ascentech LLC, North American Distributor for UK-based Aprotec Instrumentation, announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use benchtop non-contact SPI measuring systems capable of meeting the needs of today's demanding PCB production and assembly environment.

From the innovative Z-Check 3D through to the entry level Z-Check 100,  the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.

The Z-Check 3D system is the latest addition to the successful Z-check family. It provides a large scanning area and unique 5-line LED scanning in addition to all the major features of this well established bench top solder paste inspection system.

The Z-Check 900S, the top of the range 2D system employs a large capacity motorized stage with “teach and learn” positioning software, laser pointer as standard and automatic Z axis measurement.

The best-selling Z-Check 600/600S features greater measurement capacity utilizing Aprotec’s Maglok table, integrated controls, automatic Z axis measurement and a laser pointer option.

The Z-Check 100 offers a low cost solution to PCB quality control with automatic Z axis measurement using a manually positioned Friction Free Glide stage.

The Z-Check CP50 Co-Planetary Inspection system provides the means by which visual inspection and accurate assessment of an IC package can greatly reduce or eliminate the risk of dry jointing or component failure.

In addition to the measurement of rectangular and square pads, all 2D Z-Check systems can assess the geometric properties of angles, circles, and irregular shapes.

For more technical information and pricing, contact Randy Allinson, Ascentech LLC, 127 Goose Hill Rd., Chester, CT, 06412: Tel 860-526-8903, e-mail rallinson@snet.net.


Ascentech, LLC is a Manufacturer’s Representative and Distributor of Products and Services for Electronics Manufacturing and Printed Circuit Board Fabrication. Ascentech is the North American Distributor for GEN3 Systems, and GEN3 is the World-wide distributor for Aprotec. Ascentech LLC represents premier production and product reliability test equipment including the GEN3 MUST III -Solderability test systems (wetting balance), Auto-SIR –Surface Insulation Resistance test, CM-Series - Cleanliness test (ionic contamination), and SPA-1000-Solder Paste Analyzer. To learn more about the company visit www.ascentechllc.com

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