Sep 30, 2014 IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings yesterday in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
For their leadership of the 3-11 Laminate/Prepreg Materials Subcommittee that developed IPC-4101D, Specification for Base Materials for Rigid and Multilayer Boards, Tony Senese, Panasonic Electric Works, and Doug Sober, Shengyi Technology Co. Ltd., were honored with a Committee Leadership Award. Earning Distinguished Committee Service Awards for their contributions to IPC-4101D were: Michael Beauchesne, Amphenol Printed Circuits, Inc.; Tracy Cai, Shengyi Technology Co. Ltd.; Terry Fischer, Hitachi Chemical Co. America, Ltd.; Robert Hearn, Dow Chemical USA; Stan Heltzel, European Space Agency; Philip Henault, Boeing Company; Doug Leys, Nelco Products Inc.; William Ortloff, Raytheon Company; Karl Sauter, Oracle America, Inc.; Rolland Savage, High Performance Copper Foil Inc.; David Sommervold, The Bergquist Company, Prescott; Crystal Vanderpan, UL LLC; and Dan Welch, Arlon Materials for Electronics.
For their leadership of the 5-22a J-STD-001 Task Group that developed IPC-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, Teresa Rowe, currently with IPC, and Daniel Foster, Missile Defense Agency, each earned a Committee Leadership Award. For their extraordinary contributions to IPC J-STD-001F, the following individuals were honored with Distinguished Committee Service Awards: Jennifer Day, U.S. Army Aviation & Missile Command; Constantino Gonzalez, ACME Training & Consulting; and Kathy Johnston, Raytheon Missile Systems, earned Special Recognition Awards. For their outstanding contributions to IPC J-STD-001F, James Blanche, NASA Marshall Space Flight Center; David Carlton, U.S. Army Aviation & Missile Command; Robert Cooke, NASA Johnson Space Center; Lauren Cohen, Continental Automotive Systems; James Daggett, Raytheon Company; Charles Gamble, NASA Marshall Space Flight Center; Gary Latta, NASA Marshall Space Flight Center; Lisa Maciolek, Raytheon Company; Doris McGee, NASA Marshall Space Flight Center; and Garry McGuire, NASA Marshall Space Flight Center; received .
Leaders of the 7-31b IPC-A-610 Task Group that developed IPC-A-610F, Acceptability of Electronic Assemblies, Jennifer Day, U.S. Army Aviation & Missile Command; Constantino Gonzalez, ACME Training & Consulting; and Kathy Johnston, Raytheon Missile Systems, received Committee Leadership Awards. For extraordinary contributions to IPC-A-610F, Daniel Foster, Missile Defense Agency and Teresa Rowe, currently with IPC, each received a Special Recognition Award. For their outstanding contributions to IPC-A-610F, Ken Moore, Omni Training Corp.; Anitha Sinkfield, Delphi Electronics and Safety; and Rainer Taube, Taube Electronic GmbH, received Distinguished Committee Service Awards.
For extraordinary contributions to both IPC J-STD-001F and IPC-A-610F, Special Recognition Awards were presented to: Elizabeth Benedetto, Hewlett-Packard Company; David Decker, Samtec, Inc.; Bert El-Bakri, Inovar, Inc.; Cynthia Gomez, Continental Temic SA de CV; Omar Karin Hernandez, Flextronics Manufacturing Mex, SA de CV; Paula Jackson, Raytheon, UK; Joseph Kane, BAE Systems Platform Solutions; Douglas Pauls, Rockwell Collins; Kristen Troxel, Hewlett-Packard Company; Debbie Wade, Advanced Rework Technology – A.R.T; and Linda Woody, Lockheed Martin Missile & Fire Control.
Honored with Distinguished Committee Service Awards for outstanding contributions to both IPC J-STD-001 and IPC-A-610F were: David Adams, Rockwell Collins; Floyd Bertagnolli, STM – Service to Mankind; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Casimir Budzinski, Safari Circuits Inc.; Calette Chamness, U.S. Army Aviation & Missile Command; Nancy Chism, Flextronics; Dorothy Cornell, Blackfox Training Institute; Miguel Dominguez, Continental Temic SA de CV; Ron Fonsaer, PIEK International Education Centre (I.E.C.) BV; Robert Fornefeld, L-3 Communications; Stephen Fribbins, Fribbins Training Services; Gaston Hidalgo, Samsung Telecommunications America; David Hillman, Rockwell Collins; Shelley Holt, L-3 Communications; Bruce Hughes, AMRDEC MS&T EPPT; Greg Hurst, RSI, Inc.; Patrick Kane, Raytheon System Technology; Sean Keating, Amphenol Limited (UK); Vijay Kumar, Lockheed Martin Missile & Fire Control; Leo Lambert, EPTAC Corporation; Israel Martinez, Continental Automotive Nogales S.A. de C.V.; John Mastorides, Honeywell Aerospace; Randy McNutt, Northrop Grumman Corp.; George Millman, Raytheon Missile Systems; Mary Muller, Crane Aerospace & Electronics; David Nelson, Raytheon Company; William Ortloff, Raytheon Company; Gregg Owens, Space Exploration Technologies; Agnieszka Ozarowski, BAE Systems; Mel Parrish, STI Electronics, Inc.; Helena Pasquito, EPTAC Corporation; Sam Polk, Lockheed Martin Missile & Fire Control; Guy Ramsey, R & D Assembly; Doug Rogers; Richard Rumas, Honeywell Canada; Patricia Scott, STI Electronics, Inc.; Jose Servin, Continental Temic SA de CV; Adam Stanczak, Molex Incorporated; Zenaida Valianu, Celestica; Sharon Ventress, U.S. Army Aviation & Missile Command; Jonathon Vermillion, Ball Aerospace & Technologies Corp.; John Vickers, Advanced Rework Technology – A.R.T; and Neil Wolford, Logic PD.
For their outstanding contributions to IPC-8701, Final Acceptance Criteria Standard for PV Modules-Final Module Assembly, Jim Garner, 2BG Solar and Dennis Willie, Flextronics International, earned Distinguished Committee Service Awards.
For more information on these awards or the award recipients, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
».gif)
