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EI Microcircuits Leverages ECD’s Suite of Measurement Technologies to Ensure Robust Thermal Processes

Nov 01, 2015

ECD’s Super M.O.L.E. Gold 2 and OvenRIDER keep thermal processes in control to raise yield, enable fast NPI and reduce cost.

ECD’s Super M.O.L.E. Gold 2 and OvenRIDER keep thermal processes in control to raise yield, enable fast NPI and reduce cost.

High-mix, medium-volume contract manufacturer, EI Microcircuits specializes in high-quality design, engineering and production of PCBs used in the industrial controls, medical and government sectors.   With diverse and multiple jobs running throughout the Southern Minnesota-based EMS firm’s three facilities, ensuring tight reflow soldering processes is critical to high-yield and cost-effective manufacturing.  For this important assembly process, EI Microcircuits relies on ECD’s M.O.L.E.® thermal profiling and OvenRIDER® technologies.

Our M.O.L.E. thermal profilers and OvenRIDERs are easy to use and keep our process in control,” explains EI Microcircuits’ Manufacturing Engineer, William Kramlinger, who notes that the company has relied on ECD’s thermal measurement tools for nearly two decades.  “Operators, technicians and engineers use these systems daily and they have allowed us to be faster with new product introductions and verification of in-spec systems to avoid unnecessary changeovers, which cost time and money.”

Oct 31, 2017 -

ECD to Display Complete Range of Thermal Profiling and Verification Solutions, Introduce Breakthrough Oven Process Monitoring Technology at Productronica 2017

Mar 01, 2017 -

ECD Ranks Highest Among Soldering Equipment Providers, Honored with Second Consecutive Service Excellence Award

Apr 07, 2016 -

ECD’s Customers Give High Marks for Service; Company Earns a Coveted Service Excellence Award

Mar 22, 2016 -

ECD Expands Successful SmartDRY™ Intelligent Dry Storage Portfolio with Addition of SmartDRY SD-48F

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ECD Taps Todd Clifton to Lead Company.

Nov 05, 2012 -

Do You Own the Oldest M.O.L.E.®? Enter to Win a SuperM.O.L.E.® Gold 2 kit

May 31, 2012 -

ECD Releases M.O.L.E. MAP 3.00 Thermal Profiling Software; Customers Realize Cost and Time Savings

Apr 13, 2009 -

ECD Debuts Thermal Quality Management Program: ThQM

Apr 09, 2009 -

ECD Launches New Thermosphere BLOG for Electronics Industry

Aug 02, 2001 -

ECD Soldering Seminar Will Help Improve Yields, Reduce Re-work and Increase Profitability!

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