Jan 05, 2017 
BGA Inspection & Defect Photo Album (Can be downloaded)
The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
BGA Component Types, Pad Types, Via Mounting, Resist Apertures, Pasted Boards, Solder Joints on Surface and Via Mounted, Location Marks, Poor PCB Wetting, Resist Damage, Component Cracking, Missing Balls, Ball Shear Tests. Microsections of Component Cracking, Satisfactory BGA Joints, Non Wetting, Coplanarity Problems, Cracked Joints, Delamination of Die. X-Ray Images of Voiding, Missing Balls, Short Circuits and Non Reflow for further information go to http://www.bobwillis.co.uk/product-category/photo-cd-rom/
