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MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Apr 24, 2017

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

“We are very excited about these new products that we will be presented at NEPCON CHINA 2017,” stated Kane Bae, President of MIRTEC’s Chinese Sales and Service Division. “MIRTEC will feature a total of six inspection systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry. Not only SMT but Semiconductor/LED manufacturing. We will introduce our new machines in advance.”

The MV-6 (18M) is the world’s highest spec 2D AOI System - 18 Mega Pixel center camera, 7.3 µm lens and 18 Mega Pixel side camera. Inspection speed has been increased dramatically by upgrading pixel resolution while improving the lens spec with a 7.3 µm precision lens capable of inspecting 0201 (mm) chips.

MIRTEC’s upgraded side camera system will be applied from 10-18 Mega Pixel, which is a pixel resolution improvement of 80 percent. The four side cameras will now inspect PCBs with the center camera at the same time, eliminating inspection speed issues.

The side camera is specialized to inspect QFN and J-lead solder, which cannot be inspected with 3D or center cameras. Therefore, a combination of center and side camera inspection makes for a perfection inspection solution. Furthermore, whole-PCB inspection with side cameras will be possible, which is a technology exclusive to MIRTEC.

In addition, 8 phase coaxial color lighting system supports micro-crack and reflective surface component inspection, while the Intelli-Scan® laser can be attached for lifted lead inspection by measuring lead heights via laser sensor.

The MV-3 OMNI is MIRTEC’s new offline 3D Desktop AOI. MIRTEC is sure that this system will be one of the most revolutionary machines this year. A few companies have launched off-line 3D AOI already, but have faced challenges entering the market due to their low performance and high cost. Offline AOI is primarily used for small quantity batch production or subcontracted production because of its space utilization and material handling method. MIRTEC developed an off-line 3D AOI for these manufacturers that require 3D inspection but not specifically in-line.

The distinguishing feature of the MV-3 OMNI is its optical system. Other off-line 3D AOI suppliers have low-tier optical systems compared with the optics of their in-line equipment. MIRTEC’s MV-3 OMNI is equipped with the same optical system as the award winning MV-6 OMNI - 15 Mega Pixel CoaXPress center camera and 8 phase coaxial color lighting system. Like the new MV-6, the MV-3 OMNI is capable of simultaneous whole-PCB inspection with center and side cameras.

In summary, MIRTEC’s new off-line 3D AOI, MV-3 OMNI, is not low-grade version of our in-line AOI. It brings the same high performance as an in-line 3D AOI, catering to the needs of small batch manufacturers.

MIRTEC’s existing products, well-known to customers, have been upgraded as well:

The award-winning MV-6 OMNI 3D AOI machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D inspection technology which combines our 15 Mega pixel CoaXPress center camera with MIRTEC’s digital 8 projection moiré 3D system. MIRTEC’s Digital 8 projection moiré system provides true 3D inspection using programmable digital moiré projectors to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post reflow. 8 phase coaxial color lighting system that make micro-crack and reflective component inspection possible. In addition, the revolutionary 18 mega pixel side camera system option for J-lead and QFN inspection is available for this machine, too. The MV-6 Omni provides full-coverage for all kinds of defects seen within the SMT industry.

The MV-9, the high-end 3D AOI of MIRTEC, is for those customers who need extremely precise inspection, like within the Semiconductor manufacturing industry. The MV-9’s astonishing 25 mega pixel 7.7㎛ optics don’t’ miss any defects on component and solder, and its precision linear motor drive system provides high repeatability data.

The MS-11e, MIRTEC’s award-winning 3D SPI machine, is configured with MIRTEC’s exclusive 15MP CoaXPress vision system, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. This machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. PCB warpage compensation is possible by using laser unit and Z-axis movement. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

The last machine to introduce, the MV-9UP, is the most exotic inspection system among these machines. This machine is specialized for LED industry, for inspection for LED components’ package, chip, ball and wire after encapsulation. With its 3D HAP(High Accuracy Profile) sensor that has 0.4㎛ accuracy, this machine can measure height of transparent epoxy on LED components, and its 25 mega pixel 4/6㎛ top-down camera never miss defects on super-micro-size inspection items like wire and die on LED. Furthermore, its high-brightness 7 color lighting system supports inspection for micro crack on transparent epoxy.

Today, all SMT equipment manufacturers are focused on Industry 4.0, or realization of the Smart Factory. MIRTEC showed a SPI-AOI-AXI connection with its Smart Loop system last year. The next step is to make a universal connection with all SMT manufacturing equipment.

One management system that MIRTEC is excited to introduce is the SPC server. Other companies’ quality management systems are built-in or a remote workstation systems, which have limitations on performance. MIRTEC’s SPC server consists of a server system. It surpasses built-in or workstation systems for data collection, storing, analyzing and indexing speed.

The SPC server can store 2-years of data and images for 5 machines at minimum system setting. At maximum system setting, the SPC Server can store 5-years of data and images for 16 machines. Therefore, even if the factory has multiple production lines, only one SPC server is needed. Inspection data is duplicated whenever it is stored, in preparation for urgent situations.

The SPC Server is a solution for manufacturers looking for an incredibly fast, big data analyzing system that provides instant review data. The SPC Server is the proper Smart Factory quality management system.

“MIRTEC has earned a solid reputation in the Chinese market, not only SMT but SEMI and LED industries also, by providing unquestionable performance, quality and cost-effectiveness to the customers,” continued Mr. Bae. “We look forward to welcoming visitors to our booth #1J10 during the three-day event.”


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com.

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