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SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

May 15, 2017

Best Emerging Exhibit / Best Exhibit Technology Awards presented by SMTA China during the SMTA China East Conference 2017.

Best Emerging Exhibit / Best Exhibit Technology Awards presented by SMTA China during the SMTA China East Conference 2017.

Best Paper / Best Presentation Awards presented by SMTA China during the SMTA China East Conference 2017.

Best Paper / Best Presentation Awards presented by SMTA China during the SMTA China East Conference 2017.

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Flexs Henley Zhou was awarded The Best Paper of Technology Conference One for the paper titled “The Study of the Effect of PTH Diameter, Connection Type and Amount of Connected Copper On PTH Hole Fill Percentage By Wave Soldering.”

KYZEN’s Daniel Gao was awarded The Best Paper of Technology Conference Two for the paper titled “Cleaning Agent Innovation for Highly Dense Electronic Assemblies.”

Keith Bryant, from SMT Solutions, and Michael Tang, from YXLON International GmbH, received the award for The Best Presentation of Technology Conference One for the presentation titled “Computer Tomography from Microelectronics to Assembled Products.”

Dr. Wayne Koh, from Pacrim Technology Inc., received the award for The Best Presentation of Technology Conference Two for the presentation titled “Progress in Low Temperature Lead-Free Solder for SMT Assembly.”

Ji Xu, from ASM Assembly Systems Ltd., received the award for The Best Presentation of Vendor Conference One for the presentation titled “Smart #1 SMT Factory - Our Smart Move to Industry 4.0.”

Derek Wang, from AIM Solder (Shenzhen) Company Limited, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance.”

Yu Xiang, from Shenzhen City TongFang Electronic New-material Co., Ltd., received the award for The Best Presentation of Vendor Conference Three for the presentation titled “QFN Solder Void Solution Study.”

Dongguan Anda Automation Equipment Co., Ltd. received the award for The Best Emerging Exhibit of the Year 2017 China East with the product of “Dispenser Machine” and Model of “AD-16”.

Cencorp Automation Oy received the award for The Best Exhibit Technology of the Year 2017 China East with the product of “In-Line Router” and Model of “1000BR”.

 

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