SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Jan 24, 2018

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit in Booth #3525 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing. With different modules, the system can grow synchronously with customer requirements for performance and processes. The company also will demonstrate the compact Spider jet dispenser and two FOX² systems – one with the solder paste Jet valve and one with the micro screw valve.

Puma and Tarantula
Puma is world’s the first high-speed pick-and-place solution that can also be used in the ultra-flexible prototyping development sector. With an IPC assembly performance of 18’100 cph, the machine pushes forward into the mid-range field. To further increase flexibility, it boasts up to 280 feeder positions; this means Puma offers the highest number of feeders in relationship to the machine’s foot print. It processes PCB sizes up to 1’800 mm x 610 mm.

Aside from handling the assembly processes, Puma also dispenses and jets in parallel up to 150’000 dots per hour. When all three axis are used exclusively for dispensing fluids, the platform is called Tarantula. There are five valve technologies to choose from, and with the plug-and-play method, all heads can be retrofitted or changed over on site.

The newly implemented linear motor technology paired with the material “Epument” for the mineral cast frame gives a speed increase of up to 52.5 percent versus the previous model. The updated vibration absorption through the mineral cast frame guarantees high and consistent accuracy over many years of use. Replacing the traditional spindles and belts with the linear motor technology means the required maintenance is significantly reduced. Additionally, the assembly and dispensing processes are displayed on the same X/Y system.

The system’s software also has been optimized. The clearly structured interface on a large touch screen monitor is as easy to operate as a smart phone. This enables the operator to process both simple assembly groups as well as more complex projects with mixed processes, 2.5D applications and more, direct on the machine. The management can check the efficiency of the machine at any time and Essemtec offers on-line support service.

The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12". Components with sizes from 01005 up to 1.3 x 3.1"are placed. The machine achieves 7,500 cph (IPC9805A) at 50 µm, 3 sigma with a two nozzle head.

The Spider can utilize two dispensing Jet valves rated at up to 150,000 dots per hour. It dispenses 3D patterns and is easily adapted to your application. The Spider occupies only 1 m² of floor space and features linear motor drives for high accuracy: 40 µm (3σ) at full speed. Job changeover is quick with intuitive CAD import and job preparation. Mapping of heights by laser technology enables 3D applications. A mineral-cast chassis provides stability at varying temperatures.

For more information, contact Steve Pollock at 856-218-1131 (desk), 856-524-1110 (mobile) or sales@essemtec-usa.com. To view the latest information and videos visit www.essemtec-usa.com.

Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage

Nov 05, 2021 -

Essemtec Won the 2021 Mexico Technology Innovation Award for Its Solder Paste Jet Dispensing Solution

Nov 05, 2021 -

Nano Dimension Acquires Essemtec AG, Surface-Mount Pick & Place Systems Supplier for the PCB and OEM Industries

Oct 13, 2021 -

Essemtec Will Demo New Multi-Function Solder Paste Jetting Solution at Productronica 2021

Oct 07, 2021 -

Essemtec to Show the Latest Innovation for Solder Jet Printing at SMTAI

Aug 26, 2021 -

Essemtec joins forces with Restronics in Florida

Aug 13, 2021 -

Flexible Circuits, Inc. uses Essemtec FOX2 for high-rel flex-centric electronic interconnect assemblies

May 25, 2021 -

Essemtec Expands into Puerto Rico with APT

Jan 06, 2021 -

30 Year Anniversary for Swiss Success Story Essemtec

Oct 29, 2020 -

Essemtec Receives Award for Its Newest Innovation in Solder Jet Printing

Aug 15, 2020 -

Essemtec to Host Unique Webinar for Its Newest Innovation in Solder Jet Printing

209 more news from ESSEMTEC AG »

Aug 12, 2022 -

IGBT cleaning machine,leadframe, IGBT, IPM, BGA, CSP package flux cleaning machine

Aug 11, 2022 -

Ionic Contamination Tester,Ionic Contamination Tester for SMT,PCB Ionic Contamination Tester

Aug 09, 2022 -

ViTrox PCB SMT Vision Inspection Solution Adopts the IPC CFX Standards

Aug 08, 2022 -

IPC Offers First Advanced Packaging Symposium Building the IC-Substrate and Package Assembly Ecosystem

Aug 08, 2022 -

Seika Machinery Offers Service and Repairs for Its Leading Brands

Aug 08, 2022 -

IPC E-mobility, Quality & Reliability Advisory Council Members to Speak at Electric and Hybrid Vehicle Tech Expo/The Battery Show North America

Aug 08, 2022 -

DFI, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Aug 08, 2022 -

Indium Corporation's Donna Vareha-Walsh Elected to American Tin Trade Association Board of Directors

Aug 08, 2022 -

STI to Sponsor "J-STD-001H Objective Evidence for Reliability Workshop" Presented by Magnalytix and Restronics Southeast

Aug 08, 2022 -

Torenko & Associates offers the new 3D SPECTASCOPE™ from WPI Vision

See electronics manufacturing industry news »

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX news release has been viewed 980 times

  • SMTnet
  • »
  • Industry News
  • »
  • Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX
Global manufacturing solutions provider

Fluid Dispensers