Feb 19, 2018 
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its ReticleSense® Auto Multi Sensors – the world’s most efficient and effective wireless measurement devices for semiconductor fabs and equipment OEMs at SPIE Advanced Lithography at the San Jose Convention Center, February 27-28th at booth #314.
ReticleSense Auto Multi Sensors (AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The AMSR speeds equipment qualification, shorten equipment maintenance cycles and lower equipment maintenance expenses. Multiple measurements can be captured and monitored in all locations of the reticle environment, saving equipment engineers or process engineers’ time and expense.
CyberOptics will also demonstrate the ReticleSense Airborne Particle Sensor (APSRQ) that speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. Engineers can save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs. In addition to small particles, the large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.
The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensors (APS2 and APS3) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.
CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the success of CyberGage360; and other factors set forth in the Company’s filings with the Securities and Exchange Commission. For more information about the entire line of CyberOptics solutions please visit www.cyberoptics.com.
