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BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Feb 19, 2018

PYRAMAX™.

PYRAMAX™.

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.

TrueFlat technology is an optional configuration of the PYRAMAX™ convection reflow oven for substrate flatness.

Designed for substrate thicknesses of 0.15 to 0.30 mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to PYRAMAX’s closed-loop convection heating.

The new PYRAMAX with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.


BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.

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