SMT, PCB Electronics Industry News

SHENMAO Technology Inc. Exhibits at NEPCON Vietnam 2018

Oct 01, 2018

SHENMAO Technology, Inc. today announced plans to exhibit in Booth A21 at NEPCON Vietnam, scheduled to take place Oct. 11-13, 2018 at the Saigon Exhibition and Convention Center in Ho Chi Minh, Vietnam. SHENMAO will introduce the PF606-P245 solder paste PF606-F13 as well as the PF604-JF3 solder wires.

PF606-P245 solder paste has solved head-on-pillow issues and improved ICT testability. With the wide reflow window, PF606-P245 can fit easily into the process of most complicated PCB design.

PF606-F13 is a lead-free and halogen-free solder wire designed for automatic soldering machines. It offers excellent solder joint reliability and joint strength.

PF604-JF3 is suitable for high-temperature flame type soldering, which is used in the bending process of copper tubes for air conditioners.

NEPCON Vietnam 2018 is the 11th edition of Vietnam’s only exhibition on SMT, testing technologies, equipment and supporting industries for electronics manufacturing. It is the region’s premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain.

Visit SHENMAO in Booth A21 to speak with the company’s technical experts. For more information, please visit www.shenmao.com.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

Mar 18, 2024 -

SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

Mar 18, 2024 -

SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO

Feb 12, 2024 -

New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO

Jan 15, 2024 -

SHENMAO Embarks on Expansion with a New Factory in Texas to Serve Automotive Applications

Dec 18, 2023 -

SHENMAO Debuts High Thermal Impact Reliability No-Clean Solder Paste PF918-P250, Elevating Automotive Electronics Performance

Nov 20, 2023 -

SHENMAO Holds Celebration for 50 Years of Quality Solder Innovation

Oct 31, 2023 -

SHENMAO Wins Mexico Technology Award for Innovative SMBF-08 Visible No-Clean BGA Flux

Oct 23, 2023 -

SHENMAO Develops Innovative PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste

Sep 14, 2023 -

SHENMAO Introduces Low-Temperature Ball Attachment Process Solutions

Aug 14, 2023 -

SHENMAO Introduces Cutting-Edge Low-Temperature Lead-Free Solder Wire PF735-LT201

109 more news from Shenmao Technology Inc. »

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

SHENMAO Technology Inc. Exhibits at NEPCON Vietnam 2018 news release has been viewed 680 times

Jade Series Selective Soldering Machines

Void Free Reflow Soldering