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PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Jan 22, 2019

The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.

The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”. The TF1800 will be on display at our booth (#2809) and will be available for live demonstrations.

Both systems incorporate a groundbreaking top-side Inductive-Convection heater. The unique, newly-patented Inductive-Convection heater technology provides rapid heat-up and active cooling of the solder joint, resulting in faster throughput and greater process control. The Inductive-Convection technology allows for an active cooling feature, which provides swift, yet controlled component/PCB cool down, directly through the nozzle, yielding the highest quality joints. Its high efficiency, low thermal mass design takes far less power to operate and is more reliable than conventional heaters. An automated reflow head is driven by an advanced stepper motor, which provides smooth, high precision, repeatable movement, with no drift, allowing for soft landing of components and 30µm (0.0012”) placement accuracy.

In addition, an advanced vacuum pick/shaft design is counterweight balanced to eliminate placement pressure on components and uses precision high temperature linear ball bearings for highest sensitivity in placement & pick-up. PACE’s exclusive adjustable height bottom-side IR preheater allows the operator to get closer to the PCB for the most challenging high thermal mass boards.

Other features include an HD vision overlay system for optical alignment with quad-field imaging capability for alignment of outsized BGA’s or large fine-pitch QFP’s; integrated underside board support to prevent sagging during reflow; and fourth generation software guides operators through an intuitive interface that virtually automates the process.


PACE Worldwide has been providing the most innovative, cost-effective solutions in hands-on soldering, rework and repair of advanced electronics to companies and government around the globe for almost 60 years. Since the dawn of the modern electronics industry, PACE has played a key role in the development of groundbreaking products, training films, curricula, materials and electronic assembly standards, including several soldering, surface mount and thru-hole rework videos co-produced with the IPC and industry.

Aug 29, 2019 -

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Jan 22, 2019 -

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Nov 06, 2018 -

PACE Worldwide Welcomes Justin Livesay as US Western Region Sales Manager

Sep 20, 2018 -

PACE to Sponsor IPC Hand Soldering Competition at What’s New in Electronics (WNIE) Show in UK on 25-26 September

Sep 20, 2018 -

PACE to Sponsor IPC Hand Soldering Competition at What’s New in Electronics (WNIE) Show in UK on 25-26 September

Jul 24, 2018 -

PACE Introduces New Upgraded TD-100A Tip-Heater Cartridge Soldering Iron for IntelliHeat Systems

Apr 25, 2018 -

PACE Worldwide Appoints Neil Manson as European Regional Sales Manager

Jan 13, 2018 -

PACE to Introduce New Low-Cost ADS200 AccuDriveTM Production Soldering Station at IPC Apex Booth #2405

Oct 11, 2017 -

PACE Delivers 100th PRC 2000 Miniature/Microminiature Repair System to DLA under $1.2 Million Contract

Mar 13, 2017 -

PACE Introduces ST 925 Low Cost SMT Rework System

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