SMT, PCB Electronics Industry News

SEHO to Demo the Modular SelectLine-C at productronica China

Jun 07, 2020

SEHO Systems China Ltd. today announced plans to exhibit at productronica China, scheduled to take place July 3-5, 2020 at the Shanghai National Exhibition and Convention Center. The company will showcase the SelectLine-C in the German Pavilion in hall 6.1, booth #C302.

Time plays a key role in modern electronic production. With the SelectLine platform, SEHO developed a selective soldering system that features a revolutionary design. The SelectLine convinces with highest precision and solder joint quality as well as a high degree of flexibility: No change-over is required to dynamically process a variety of assemblies with short cycle times, in either mini-wave processes or multi-wave soldering processes.

The modular design of the SelectLine-C enables it to be used for standalone operation or expanded with additional modules at any time to be used inline. Modules with different dimensions can be individually configurated with fluxer, preheating, soldering units, cooling modules, selective brush system and AOI and, depending on the requirements, they may be combined to a complete manufacturing line. It is extendable up to 6 soldering units and more than 15 parallel workstations in one system.

The modular machine concept and numerous configuration possibilities allow adaptation to nearly all production requirements. Maximum throughput requirements are met with the SYNCHRO concept – patented by SEHO. The intelligent software feature coordinates the soldering process for PCBs so that the total throughput is nearly doubled without the need for significant investment. Cycle times can be reduced by nearly 50 percent in SYNCHRO operation mode.

Additionally, automatic ultrasonic cleaning of solder nozzles ensures the highest reliability and significant time savings. What previously had to be done manually and with aggressive chemicals, now is automatically and environmentally friendly performed through the machine. By automatically performing a gentle cleaning, the lifetime of the solder nozzles is extended up to several months.

Special features are the integrated additional processes. A selective brush station for automatic cleaning of particular board areas from solder residues and solder balls can be implemented after the soldering process.

A zero-fault production turns into reality with the integration of an AOI system. Here, inspection of the solder joints is made immediately after the soldering or brushing process. Assemblies that have been detected with a fault can be removed from the inline production automatically.

The SEHO team is looking forward to welcoming visitors in hall 6.1, booth #C302.

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